Wafer thermal mapping plays a critical role in advanced semiconductor manufacturing process development, directly impacting device electrical performance, production line yield, and product reliability.

Typical process requirements include:Extreme temperature coverage from -190°C (deep cryogenic bonding processes) to 500°C (ALD thin-film deposition), with special processes such as SiC epitaxial growth requiring temperatures up to 1200°C.

Dynamic thermal management demands ±0.1°C-level temperature stability, in-plane wafer thermal uniformity ≤±1°C, and programmable temperature control rates from 0.1 to 50°C/min.

Multimodal compatibility must support in-situ detection needs such as Raman spectroscopy analysis and microscopic imaging.

GoGo Instruments specializes in temperature control technology and has customized an optical cooling stage specifically for wafer testing based on client requirements. This product utilizes resistive heating and liquid nitrogen cooling to meet extreme low-temperature experimental needs, achieving precise control within the range of -190°C to room temperature. It employs high-quality imported PT100 sensors for real-time temperature feedback and PID temperature control to ensure reliable and high-precision performance. Paired with Guoguo Instrument’s temperature control software, the system is user-friendly and supports up to hundreds of temperature control programs to simulate complex temperature environments.

Product Features and Key Parameters：

1. Test Sample: Wafer

2. On-Site Compatible Instruments: HORIBA Raman spectrometer, Zhongfeng Optoelectronics microscopic imaging system

3. Temperature Range: -190℃~150℃

4. Heating Rate: 0.1℃~30℃/min，Cooling Rate: 0.1℃~20℃/min

5. Sample Stage: Silver, dimensionsφ101.6mm（4 inch）

6. Extra-Large Viewport: Diameter 120mm; distance between viewport upper surface and sample stage is only 13.5mm, compatible with higher-magnification objectives.

7. Vacuum Chamber: ＜1Pa

8. Equipped with 20L Liquid Nitrogen Dewar: Ensures long-duration low-temperature testing

9. Key Features: Oversized silver alloy stage with excellent surface temperature uniformity

GoGo Instruments conducted temperature uniformity tests on the custom optical cooling stage. At liquid nitrogen temperature, the surface temperature uniformity was exceptionally high, earning strong client approval.

1. At Room Temperature

Sensors maintained excellent contact with the sample stage surface. Maximum-minimum sensor reading difference: 0°C | Temperature stability: ±0°C. No performance variation observed across the four temperature sensors.

2. Cooling to Liquid Nitrogen Temperature

Maximum-minimum sensor reading difference: 0.5°C | Temperature stability: ±0.25°C.

3. Multi-Segment Programmable Temperature Control

In addition to excellent low-temperature performance, the system demonstrates outstanding performance in the high-temperature range (RT to 150°C), offering strong scalability to meet potential high-temperature testing needs.

Equipment in Use

↑ Optical cooling stage compatible with HORIBA Raman spectrometer

↑On-site wafer sample testing